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Power and Speed settings

  • NOTE: The power and speed settings below reflect materials that are UNPROTECTED. These settings have been tested and set to reduce scorching, melting and off gassing.
  • If a color other than those specified below are configured, the laser cutter AUTOMATICALLY defaults that color to the power and speed of white (cut through material).
  • White (cut through material) is a different power and speed than all the other colors. The settings below are shown as Power slash speed.
  • Speeds can be varied up or down to vary the cut / etch depth. Decreasing the speed, increases the depth of the cut.

If additional depth is required from the etch / cut, it is suggested that multiple laser passes be conducted in order to keep the heat and over burning to a minimum.

  • Provided materials must be smaller than 18" x 32". Materials not sitting flush on the cutting surface will be rejected.
  • All materials must be devoid of dust, dirt, and any paper backing on the front of the material.
  • PLEASE NOTE: All etch settings were removed due to complaints made about the settings being inaccurate. If you intend on etching your materials, please do a series of tests to verify that the settings you are using are to your liking for the material that you are using.

Materials List

Material White (cut)
Power/Speed
1/16" acrylic 80/6
1/8"acrylic 100/2.3
1/4" acrylic 100/1.0
3/16" acrylic 95/1.0
3/8" acrylic 100/1 (3X passes)
1/2" acrylic 90/1 (3X passes)
mylar 20/85
1-ply chipboard 17/6
NOTE: No etching permitted on this material due to increase fire hazard
2-ply chipboard 70/6
1/32" basswood 10/6
1/16" basswood 30/6
1/4" basswood 80/3.5
1/16" birch plywood 80/8
1/4" birch plywood 100/3.6
corrugated cardboard 55/8
1/16" museum board 70/20
strathmore board 40/25

Etching

The "Best Etch Power Settings" above is the optimal power setting for etching out voids of various depth out of the material. Setting the speed to differing speeds will change the depth of the etch. The slower the speed, the deeper the etch. Some materials are limited to the extent of etch possible due to material thickness.

Masking

For most plastics it should only be left on the bottom side of the material. Especially important when engraving, other wise it will compromise the etched surface as it cools and become embedded in the material. The blue plastic cover is of a poor quality and will melt a lot quicker than the material so will leave a residue in the cut, and on the cutter’s optics. The underside is more important to protect because it faces more exposure to flashback and scorching.
For the materials that can be masked on the upper side, the mask has to be wrinkle free. If the mask is not in contact with the material at the point of cut, the gasses will get trapped under the mask and cause the same markings to the surface as if the mask was not there.

 

Contact Us | Feedback | Last updated on February 21, 2008